Grinding of silicon wafers: a review from historical perspectives
نویسندگان
چکیده
The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two other silicon machining processes (slicing and polishing). It is intended to help ∗ Corresponding author. Tel.: +1 785 532 3436; fax: +1 785 532 3738. E-mail address: [email protected] (Z.J. Pei).
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